Features
- Rated to 400°C, the HSF Series convection reflow belt furnace features an ultra-clean rapid response heating chamber.
- Precise temperature controls
- Uniform temperature distribution
- Air or Nitrogen Atmosphere
- Infra-red and/or hot air circulation heating
HSF Series furnaces can be configured for reflow soldering applications, including vacuum-assisted processes where reduced solder voiding is required. Furnace configuration depends on the solder alloy, thermal profile, atmosphere, vacuum requirements, and production throughput.
Applications
HSF series belt furnace is widely used in the following applications:
- SMD/SMT - surface mount device reflow soldering.
- PMC - post molding curing.
- Chip joing and die bonding.
- Epoxy curing, underfill curing,
- Encapsulation, etc.
HSF Series Convection / Reflow Belt Furnace Product Models
(How to read furnace model numbers?)
| Model | Heat Zones | Belt Width | Overall Length | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HSF2605-0304 | 3 | 260mm | 2445mm | ||||||||||||||||
| HSF3505-0504 | 5 | 350mm | 3260mm | ||||||||||||||||
| HSF5605-0704 | 7 | 560mm | 4075mm | ||||||||||||||||
| HSF6305-1004 | 10 | 635mm | 8535mm |
Options and Customizations
| Available Options and Customizations |
|---|
| Ultrasonic Belt Cleaning/Drying |
| Computer Control System |
| UPS |
| Customizable heating and cooling length |
Our dedicated engineers will always take the extra step to work with clients for customized designs.