Understanding the Relationship Between Semiconductors, SMT, and Microelectronics


Semiconductor relationship with SMT

Today's mainstream electronics manufacturing consists mainly of semiconductor packages and surface mount technology processes. A lesser known technology, however, is working its way into both of these markets-microelectronics.

  • SMT (Surface Mount Technology) - examples include a motherboard in a PC, or an FR4 board with ICs, resistors, and capacitors reflow soldered making a completed electronic product. The number of products built with this technology is staggeringly large.
  • Semiconductor - consider lead frame packages with a single IC that is die-attached, wire-bonded, and over-molded. These packages are made by the millions, can be surface mounted, and soldered into through hole substrates/FR4 boards. The number of products built with the technology is staggeringly large.
  • Hybrid Microelectronics - multiple ICs/packages incorporated into a space-saving package. This can include SMT and semiconductor technologies and can be very complex-mixed technologies that allow for powerful and/or small final products. The number of products built with this technology is small compared to SMT and semiconductor packaging, but it is a growing market.

While SMT technology generally incorporates semiconductor products, semiconductor products do not typically include SMT components.

Microelectronics can incorporate both, and the result is smaller and usually faster final products. Through-hole technologies are becoming rare.

Microelectronics is a growing packaging method and is working its way into both of these mainstream markets - but in a different way. Both semiconductor and microelectronic packages can utilize the same (or similar) manufacturing techniques. Both can mount bare die with conductive or non-conductive epoxies, or eutectic solders. Both generally employ traditional wire ball bonding for the first level interconnects. These markets are distinct, but they do mix.

Microelectronics can incorporate both, and the result is smaller and usually faster final products. Through-hole technologies are becoming rare.


Reference:

Powell, J. (n.d.). Understanding the relationship between semiconductors, SMT, and Microelectronics. Automated Wire Bonding, Die Attach, and Contract Assembly Services. Retrieved December 6, 2022, from https://www.palomartechnologies.com/blog/bid/117936/Understanding-the-Relationship-Between-Semiconductors-SMT-and-Microelectronics