Thick film circuit refers to an integrated circuit composed of an array film process (screen printing, sintering and electroplating, etc.) on the same substrate to make a passive network and assemble A film having a thickness of several micrometers to several dozens of micrometers or even above is generally considered to be a thick film. Thick film integrated circuits are simple in process, low in cost, and capable of high power, but the types and value of components that can be produced are limited.
Compared with thin film hybrid integrated circuits, thick film integrated circuits are characterized by more flexible design, simple process and low cost, and are especially suitable for small batch production of various varieties. In terms of electrical performance, it can withstand higher voltage, higher power and higher current. The operating frequency of thick film microwave integrated circuits can reach above 4 GHz.
It is suitable for a variety of circuits, especially analog circuits used in consumer and industrial electronics, and substrates with thick film meshes have been widely used as miniature printed circuit boards.
HSK series belt furnaces serve a variety of industries, such as microelectronics packaging, including IC, SMT, HIC, MCM, and MEMS applications, and advanced materials, including thick film, electronic components, photovoltaics, ceramics, and metalworking applications.
Thin film integrated circuits use metals, semiconductors, metal oxides, various metal mixed phases, alloys or insulating dielectric films with a thickness of less than ten micron, through vacuum evaporation, sputtering and electroplating, etc. , capacitors and inductors and other components and the interconnecting leads between them are made of integrated circuits.
Active devices in thin film integrated circuits, mainly transistors, have two material structures: one is a thin-film field-effect cadmium sulfide or cadmium selenide transistor, and the other is a thin-film thermionic amplifier. More practical thin-film integrated circuits use a hybrid process, that is, thin-film technology is used to prepare connections between passive components and circuit components on glass, glass-ceramic, glazed and polished alumina ceramic substrates. Then, the chips of active devices such as integrated circuits, transistors, and diodes, and components such as power resistors, large-capacity capacitors, and inductors made without thin-film technology are welded by hot pressing, ultrasonic welding, beam leads or bump flip-chip welding, etc. In this way, it can be assembled into a complete integrated circuit.
HSH series is equipped with infrared lamp heating; the furnace is designed for solar cell firing. Infrared lamp heating; high speed; high efficiency; high uniformity; high efficiency and energy saving; environmental protection.
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