Due to higher operating frequencies and miniature size (hence, higher thermal load of hot spots) of modern electronics LTCC is gaining more and more attention. The old technique becomes more popular due to its unique RF and thermal performance, recent qualification of LTCC materials for use in space-grade electronics and base material cost going down.
Since 2008 our team has installed several turn key facilities for LTCC production, as well as many individual units, such as via fillers or precision quartz chamber ovens. We operate on a long-term agreements with top equipment manufacturers from the USA and Europe and provide for hands on training of customers' operators and technicians.
Finally, achieving a higher definition in LTCC layers proves even harder.
Phase I: Equipment selection, delivery and installation
Floor plan and utilities advice on construction phase
Entire highly integrated production facility for LTCC and advanced packaging line, starting from ceramic powder milling, slurry preparation & tape casting (76 main items of capital equipment) configured, delivered and installed
Prior to SAT, a 2-week Customer Training was performed
Phase II: Know-how transfer and coached production using test coupons
Further training and internships for customer's operators and process engineers for 8 weeks in total was performed during SAT
LTCC test coupon was used during installation and SAT phase
Phase III: Fine Line process set up using test coupons
Multilayer fine line thick film process development was ordered after main LTCC process set up
Test coupons was used to demonstrate photoimageable fine line process boundaries in real life
If you are interested in our services such as Fine Line Thick Film Hybrids, Chip Resistors, Power IGBT Modules, Advanced Wire Bonding Applications, LED modules, Versatile Hermetic Packages Sealing, Automation, etc, please click here.